Designer

Job details

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Job description

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Company:Qualcomm India Private Limited Job Area:Engineering Services Group, Engineering Services Group > PWB Design Job Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in. 7-12 years experience in PCB layout handling both regular thru hole and HDI micro via processes. Must have skills:Strong Hands on familiarity experience and proficiency with Allegro layout tool, version 17.x preferred. Minimum 16.x. Recent work experience with Allegro is critical. We are NOT looking for a person who is leading a layout team currently with no hands-on role. High speed DDR3/DDR4 layout experience. (speeds upto 3200MT/s). Recent experience with High speed Serdes: PCIe, Ethernet, USB, speeds upto 10Gbps. Worked with complex pitch chip packages: 0.5mm DRQFN, 0.65mm BGAs. Worked with low voltage high current sensitive power layouts, multi rail PMICs. Interaction Requirements SIPI team: Concepts of Signal Integrity and Power Integrity, do SIPI aware layout design. Must work well with SIPI team (track record or experience is expected). Thermal/ mechanical: Familiarity with thermal planning and thermal/ mechanical solutions for the board design. Needs to interwork with ME and thermal team. Fab and assembly: Strong skills in interacting with PCB fab and assembly vendors for queries. Basic RF board design experience. Experience in competitive customer oriented spaces similar to ours (low layer count high performance cost sensitive PCB designs, 4-6 layers). Desirable skills: Exposure to other tool-flows PADS/ Mentor. Chip floor-planning/ trial routing experience. Ability to lead /guide 1-2 other resources is strongly desired. Advanced RF board design experience. 0.4mm pitch package handling desirable. Guidance to NPI/ assembly teams. Direct hands-on knowledge of thermal aspects. General skills: Committed team player, should demonstrably align to and works towards team goals and project goals. Good can-do attitude. Good communication skills. Professional and polite behaviour. Must maintain equipoise and work well with entire team. Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport To all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers .